Microelectromechanical systems

Results: 938



#Item
31JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 21, NO. 5, OCTOBERLaser-Driven Micro Transfer Placement of Prefabricated Microstructures

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 21, NO. 5, OCTOBERLaser-Driven Micro Transfer Placement of Prefabricated Microstructures

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Source URL: rogers.matse.illinois.edu

Language: English - Date: 2012-11-21 10:59:27
32Negative Resists for Ultra-Tall, High Aspect Ratio Microstructures S. Lemkea, P. Goetterta, I. Rudolpha, J. Goettertb,*, B. Löchela a Helmholtz-Zentrum Berlin (HZB) für Materialien und Energie GmbH, Institute for Nanom

Negative Resists for Ultra-Tall, High Aspect Ratio Microstructures S. Lemkea, P. Goetterta, I. Rudolpha, J. Goettertb,*, B. Löchela a Helmholtz-Zentrum Berlin (HZB) für Materialien und Energie GmbH, Institute for Nanom

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Source URL: www.camd.lsu.edu

Language: English - Date: 2012-08-02 10:05:16
33ABSTRACT There is an increasing demand for reliable sensor system capable of sensing and measuring interested data at a remote place. Sensors combined with wireless communication system can be an effective telemetry meth

ABSTRACT There is an increasing demand for reliable sensor system capable of sensing and measuring interested data at a remote place. Sensors combined with wireless communication system can be an effective telemetry meth

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Source URL: www.gradschool.sc.edu

Language: English - Date: 2016-07-28 15:43:48
34Copy of Session Schedule Combined Master.xlsx

Copy of Session Schedule Combined Master.xlsx

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Source URL: www.iwlpc.com

Language: English - Date: 2016-08-15 13:37:41
35High-Aspect Ratio Deep Sub-Micron α-Si Gate Etch Process Control H.-M. Park, T. L. Brock, D. Grimard, J. W. Grizzle and F. L. Terry, Jr University of Michigan 195th Spring Meeting of ECS

High-Aspect Ratio Deep Sub-Micron α-Si Gate Etch Process Control H.-M. Park, T. L. Brock, D. Grimard, J. W. Grizzle and F. L. Terry, Jr University of Michigan 195th Spring Meeting of ECS

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Source URL: web.eecs.umich.edu

Language: English - Date: 2016-04-25 13:15:12
36Investor Presentation Cowen and Company 44th Annual Technology, Media & Telecom Conference MIKE PLISINSKI, CEO STEVEN ROTH, CFO June 2, 2016

Investor Presentation Cowen and Company 44th Annual Technology, Media & Telecom Conference MIKE PLISINSKI, CEO STEVEN ROTH, CFO June 2, 2016

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Source URL: www.tamartechnology.com

Language: English - Date: 2016-06-02 09:58:33
37Imaging Bonded Wafer Defects for 3-D A practical, acoustic imaging technique is applied to bonded wafer pairs to image interface defects and wafer scratches in various materials. he range of products whose fabrication

Imaging Bonded Wafer Defects for 3-D A practical, acoustic imaging technique is applied to bonded wafer pairs to image interface defects and wafer scratches in various materials. he range of products whose fabrication

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Source URL: www.sonoscan.com

Language: English - Date: 2016-07-20 11:09:32
38ultrasound, acoustic imaging, wafer gaps, MEMS  ~.

ultrasound, acoustic imaging, wafer gaps, MEMS ~.

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Source URL: www.sonoscan.com

Language: English - Date: 2016-07-20 11:09:32
39IMU800  LOW DRIFT MEMS IMU The MEMSIC IMU800 establishes a new level of performance for standalone “unaided” inertial

IMU800 LOW DRIFT MEMS IMU The MEMSIC IMU800 establishes a new level of performance for standalone “unaided” inertial

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Source URL: www.memsic.cn

Language: English - Date: 2015-11-09 20:24:29
40Photonic Professional The next generation of 3D laser lithography High speed micro- and nanoprinting GT

Photonic Professional The next generation of 3D laser lithography High speed micro- and nanoprinting GT

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Source URL: www.nanoscribe.de

Language: English - Date: 2015-01-07 05:26:00